18
'21
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AMPHENOL News
18
'21
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Bunting europe News
Bunting at Ecomondo
With the Ecomondo Green Technology Expo encompassing the circular economy, the Bunting stand (hall A2 stand 007) focuses on material recycling through material and metal separation to neodymium magnet recovery.
18
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Wenglor News
Robust and Resistant to Cleaning: When Stainless Steel 316L Meets Optical Sensor Performance
Specialists in harsh and demanding industrial environments: Type 2K photoelectronic sensors are the latest additions to the PNG//smart product series.
16
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Phoenix Contact News
THR PCB terminal blocks up to 2.5 mm²
Phoenix Contact is extending its range of reflow-solder-capable PCB terminal blocks (MSL1) to include the 2.5 mm² cross-section.
16
'21
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AT&S News
AT&S continues to invest in its Leoben site
In view of the ongoing boom in demand in the microelectronics sector and ever-new performance requirements for electronic systems, AT&S has decided to put an even stronger focus on research and development. Therefore, the company is investing in a new R&D center for substrate and packaging solutions for the global semiconductor industry at its location in Leoben-Hinterberg. In addition, another technology upgrade of the production facilities will be implemented.
16
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Liebherr News
Bin picking made easy
“Bin picking” is among the most difficult disciplines in automation. Adjusting the parameters for reliable recognition and gripping of complex objects is demanding and requires expertise. LHRobotics.Vision, a software by Liebherr-Verzahntechnik GmbH from Kempten, now makes bin picking much easier for users through Artificial Intelligence (AI).
15
'21
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AMS News
New level of interaction – ams OSRAM expands VCSEL-portfolio for 3D gesture recognition
ams OSRAM (SIX: AMS), a global leader in optical solutions, expands its 3D sensing portfolio with four new VCSEL modules.
15
'21
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Etsi News
ETSI IPE releases the first IPv6 Enhanced Innovation Report, helping global industry players to reach a consensus
ETSI is pleased to announce the first ETSI IPv6 Enhanced Innovation (IPE) report ETSI GR IPE 001 “IPv6 Enhanced Innovation: Gap Analysis”.
15
'21
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SCHUNK News
SMART TO THE POWER OF TWO: THE NEW ITENDO2
Milling, countersinking or micro-cutting ─ the intelligent iTENDO toolholder has already proven its merit in a number of applications. Now its successor is being launched on the market: the iTENDO2 is more compact, more powerful and offers significantly more possibilities for applications.
15
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Hexagon Manufacturing Intelligence News
