Rutronik News

Rutronik and SoC supplier Rockchip sign global distribution agreement

Rutronik Elektronische Bauelemente GmbH has signed a worldwide distribution agreement with one of China's leading SoC suppliers, Fuzhou Rockchip Electronics Co, Ltd. Thus, Rutronik is the authorized distributor from Europe in the Rockchip distribution network.

SCHUNK News

Magic of tombstones and pyramids

The compact, spring-actuated TANDEM KSF plus clamping force blocks require no media supply, and are therefore ideal for storage solutions.

Siemens News

Packaging Toolbox enables easy engineering of packaging machines

The Siemens’ Packaging Toolbox is now available in its entirety for the Simatic S7-1500 controller in the TIA Portal engineering framework. It offers users packaging specific libraries which can be integrated into existing or new machine applications as well as program blocks. The Toolbox supports international standards such as OMAC, PackML and Weihenstephan Standards. By adding or modifying function blocks it can be adapted to suit individual requirements, while at the same time saving the user time during engineering and commissioning through tested functions and software solutions.

ST News

Arrow Electronics, Panasonic Industry, and STMicroelectronics Join Forces to Deliver IoT Modules for Smart Applications

The IoT Solution Module combines Arrow’s engineering and global distribution capabilities with Panasonic Industry’s IoT modules based on the ST BlueTile (STEVAL-BCN002V1B) multi-sensor development kit. This combination enables customers to test their ideas easily and bring new IoT products to the market faster.

Hexagon Manufacturing Intelligence News

Faster WORKNC Delivers on Performance

Improved Productivity Through Faster Toolpaths and a Simpler User Experience.

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