Rutronik Elektronische Bauelemente GmbH has signed a worldwide distribution agreement with one of China's leading SoC suppliers, Fuzhou Rockchip Electronics Co, Ltd. Thus, Rutronik is the authorized distributor from Europe in the Rockchip distribution network.
Amidst the COVID-19 pandemic where the ability to work from home has become an absolute necessity, NEXCOM can now help telecom and data centers across the world virtualize and expand capacity with its new NC 220FMS3 100GbE NIC module.
The Siemens’ Packaging Toolbox is now available in its entirety for the Simatic S7-1500 controller in the TIA Portal engineering framework. It offers users packaging specific libraries which can be integrated into existing or new machine applications as well as program blocks. The Toolbox supports international standards such as OMAC, PackML and Weihenstephan Standards. By adding or modifying function blocks it can be adapted to suit individual requirements, while at the same time saving the user time during engineering and commissioning through tested functions and software solutions.
The IoT Solution Module combines Arrow’s engineering and global distribution capabilities with Panasonic Industry’s IoT modules based on the ST BlueTile (STEVAL-BCN002V1B) multi-sensor development kit. This combination enables customers to test their ideas easily and bring new IoT products to the market faster.