Fraunhofer, with TSRI, develops FeMFET-based nanosheet memory under 3 nm, enabling in-memory computing for energy-efficient AI chips in smartphones, cars, and medical devices.
These new high-capacity power semiconductors achieve high moisture resistance for more efficient and reliable inverters used in large industrial equipment.
SECO’s expanded Edge AI suite delivers low-power vision, geospatial analysis, speech-to-text, fall detection and Face ID training across leading embedded platforms.