Standardized automation, data architecture and Digital Twin capabilities aim to connect research with scalable production while reducing integration complexity and scale-up risks.
Ceva and LG Electronics collaborate to integrate baseband IP and RF technologies into a silicon-ready Ultra-Wideband platform for automotive, industrial, and consumer SoCs.
Fraunhofer IPMS will present microelectromechanical spatial light modulators (SLMs) and customer evaluation kits for high-speed photonic applications at Photonix Japan 2026.
MASTERLY aims to accelerate the transition from traditional mass production to highly flexible, reconfigurable, and human-centric manufacturing systems.
HERON 300 HV combines robotic additive manufacturing, CNC machining, automation and AI to support distributed production of large industrial parts domestically.
ECP & ENP connectors combine power, signal and data transmission, supporting modular machinery, cabinet-free automation and reliable standardized connectivity across applications.
DTG-30, DTL-30 and VTL-30 measure density, viscosity and temperature with precision, supporting fuel quality, carbon capture and industrial process monitoring applications.