28 {{ "2026-10-28T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-10-28T00:00:00+00:00" | date "longDate" }}

Point S International

Point S urges the tyre trade to judge tyres on how they perform when worn

• Point S International calls on workshops, networks and OEMs to judge tyres on how they perform when worn, not when new. • Independent tests by TÜV SÜD Product Service, commissioned by Point S, put the Point S 4 Seasons 3 ahead of a selection of Tier 2 and Tier 3 brands on wet grip at 2mm of tread. It also led on wet braking, aquaplaning, cornering and snow when new. • Winter tyre rules return across Europe on 1 November, and France and Germany now accept only 3PMSF-marked tyres, which the 4 Seasons 3 range carries, giving workshops a reason to act now.

Read more…

28 {{ "2026-10-28T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-10-28T00:00:00+00:00" | date "longDate" }}

Norelem AB Info

USB and RJ45 fitted sockets for mechanical engineering and automation

norelem introduces compact fitted sockets for USB and RJ45 connections, providing accessible data interfaces for industrial enclosures, control panels, and automation systems.

Read more…

28 {{ "2026-10-28T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-10-28T00:00:00+00:00" | date "longDate" }}

Anduril News

Anduril and Qualcomm to Rebuild American Computer Manufacturing

Beginning with a U.S.-built laptop powered by the Snapdragon X Series platform, BlueChip will establish the manufacturing capabilities and supplier base needed to bring computer production back to America.

Read more…

28 {{ "2026-10-28T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-10-28T00:00:00+00:00" | date "longDate" }}

Parker News

Parker Chomerics launches reusable thermal gap filler pad

The THERM-A-GAP PAD 30RB delivers 3.0 W/m-K conductivity with excellent rebound for multiple assembly cycles.

Read more…

27 {{ "2026-10-27T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-10-27T00:00:00+00:00" | date "longDate" }}

Seco Tools

Seco introduces MS3501 milling grade for high heat and adhesive materials

Seco^® has launched MS3501, a new high productivity milling grade developed for demanding applications involving heat resistant and adhesive materials across ISO P, M, and S.

Read more…

27 {{ "2026-10-27T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-10-27T00:00:00+00:00" | date "longDate" }}

General Atomics News

Tokamak Negative Triangularity Magnetic Fusion Power

General Atomics, Columbia University, and institutional partners demonstrated negative triangularity plasma confinement to suppress wall-damaging edge instabilities in commercial fusion energy systems.

Read more…

27 {{ "2026-10-27T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-10-27T00:00:00+00:00" | date "longDate" }}

Agility Robotics News

GXO and Agility Robotics Expand Partnership

Digit humanoid robots to expand to additional GXO sites in 2027, building on industry-first Robots-as-a-Service agreement.

Read more…

26 {{ "2026-10-26T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-10-26T00:00:00+00:00" | date "longDate" }}

NEC Corporation News

Vision-Language AI Automates Disaster Precursor Detection

NEC Corporation develops an evaluation system that utilizes existing live camera networks to quantitatively analyze environmental anomalies like flooding and snow accumulation.

Read more…

26 {{ "2026-10-26T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-10-26T00:00:00+00:00" | date "longDate" }}

SpaceGuard Products News

SpaceGuard Brings RageWire Guarding to Configura Platform

The new integration streamlines industrial safety design, 3D visualization, and automated quotation for facility engineers.

Read more…

23 {{ "2026-10-23T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-10-23T00:00:00+00:00" | date "longDate" }}

RS Components News

Industrial Control Panel Components for High-Density AI Infrastructure

RS offers specialized Omron automation hardware designed to manage extreme thermal loads, maximize uptime, and monitor liquid cooling arrays in megawatt-scale hyperscale facilities.

Read more…

Market Overview

Is Manufacturing Ready for Net Zero?

Technical Articles

Why data center security is a substation problem, not a fence problem

Case studies

Advanced Automation Modernizes Automotive Coil Processing Lines

Point S urges the tyre trade to judge tyres on how they perform when worn

USB and RJ45 fitted sockets for mechanical engineering and automation

norelem introduces compact fitted sockets for USB and RJ45 connections, providing accessible data interfaces for industrial enclosures, control panels, and automation systems.

Anduril and Qualcomm to Rebuild American Computer Manufacturing

Beginning with a U.S.-built laptop powered by the Snapdragon X Series platform, BlueChip will establish the manufacturing capabilities and supplier base needed to bring computer production back to America.

Parker Chomerics launches reusable thermal gap filler pad

The THERM-A-GAP PAD 30RB delivers 3.0 W/m-K conductivity with excellent rebound for multiple assembly cycles.

Seco introduces MS3501 milling grade for high heat and adhesive materials

Seco^® has launched MS3501, a new high productivity milling grade developed for demanding applications involving heat resistant and adhesive materials across ISO P, M, and S.

Tokamak Negative Triangularity Magnetic Fusion Power

General Atomics, Columbia University, and institutional partners demonstrated negative triangularity plasma confinement to suppress wall-damaging edge instabilities in commercial fusion energy systems.

GXO and Agility Robotics Expand Partnership

Digit humanoid robots to expand to additional GXO sites in 2027, building on industry-first Robots-as-a-Service agreement.

Vision-Language AI Automates Disaster Precursor Detection

NEC Corporation develops an evaluation system that utilizes existing live camera networks to quantitatively analyze environmental anomalies like flooding and snow accumulation.

SpaceGuard Brings RageWire Guarding to Configura Platform

The new integration streamlines industrial safety design, 3D visualization, and automated quotation for facility engineers.

Industrial Control Panel Components for High-Density AI Infrastructure

RS offers specialized Omron automation hardware designed to manage extreme thermal loads, maximize uptime, and monitor liquid cooling arrays in megawatt-scale hyperscale facilities.

International

Market Overview

Technical Articles

Case studies

norelem introduces compact fitted sockets for USB and RJ45 connections, providing accessible data interfaces for industrial enclosures, control panels, and automation systems.

Beginning with a U.S.-built laptop powered by the Snapdragon X Series platform, BlueChip will establish the manufacturing capabilities and supplier base needed to bring computer production back to America.

The THERM-A-GAP PAD 30RB delivers 3.0 W/m-K conductivity with excellent rebound for multiple assembly cycles.

Seco® has launched MS3501, a new high productivity milling grade developed for demanding applications involving heat resistant and adhesive materials across ISO P, M, and S.

General Atomics, Columbia University, and institutional partners demonstrated negative triangularity plasma confinement to suppress wall-damaging edge instabilities in commercial fusion energy systems.

Digit humanoid robots to expand to additional GXO sites in 2027, building on industry-first Robots-as-a-Service agreement.

NEC Corporation develops an evaluation system that utilizes existing live camera networks to quantitatively analyze environmental anomalies like flooding and snow accumulation.

The new integration streamlines industrial safety design, 3D visualization, and automated quotation for facility engineers.

RS offers specialized Omron automation hardware designed to manage extreme thermal loads, maximize uptime, and monitor liquid cooling arrays in megawatt-scale hyperscale facilities.

International

Seco^® has launched MS3501, a new high productivity milling grade developed for demanding applications involving heat resistant and adhesive materials across ISO P, M, and S.