Siemens Digital Industries Software today announced it has collaborated with leading semiconductor foundry United Microelectronics (UMC) to develop and implement a new multi-chip 3D integrated circuit (IC) planning, assembly validation and parasitic extraction (PEX) workflow for UMC’s wafer-on-wafer and chip-on-wafer technologies. UMC plans to soon offer this new flow to its global roster of customers.
Energy efficiency, CO2 neutrality and sustainability are topics that concern you? And you want and need to act? In this live stream, we will show you concrete product examples, solution approaches as well as useful engineering tools for energy-efficient machine design.
the Swedish deep tech company today announces its partnership with US-based semiconductor company Atmosic Technologies. The partnership will enable companies to create attractive energy harvesting solutions for the Internet of Things (IoT) sector.
Basler will be introducing Add-on Camera Kits with 5 and 13 MP to support the NVIDIA® Jetson Orin Nano system-on-modules (SOMs), which have set a new baseline for entry-level edge AI and robotics, as announced today at NVIDIA GTC. Add-on Camera Kits are ready-to-use vision extensions that include an adapter board, camera, lens, and cables.
The cam lever allows the quick and effective clamping of a panel (for example a door) to a structure (for example a frame), The elastic retaining element in NBR rubber allows to obtain a perfect closure even in the event of vibrations or misalignment between the two parts.
CONTA-CLIP, a specialist in connection technology and one of Europe’s leading terminal block manufacturers, offers a range of terminals that is unique on the market in terms of comprehensiveness and advanced design.
In order to contribute to reducing the carbon footprint of digital technologies through research and development, the Fraunhofer and Leibniz institutes cooperating in the Forschungsfabrik Mikroelektronik Deutschland (Research Factory Microelectronics Germany) are jointly establishing a cross-site competence center for resource-conscious information and communications technology (Green ICT @ FMD).
Rohde & Schwarz presents an innovative signal generation and analysis solution for measurements in the D band that will significantly simplify early next generation mobile communications research. The new R&S FE170 frontend extensions are easy to mount to and configure with the R&S SMW200A vector signal generator and the R&S FSW signal and spectrum analyzer. The extensions will allow the two high-end test instruments to cover frequency ranges between 110 GHz and 170 GHz – key spectrum for beyond 5G, for 6G technology and for future automotive radar applications.