Ceva and LG Electronics Partner for Complete UWB Platform

Ceva, Inc. and LG Electronics have announced a collaboration to deliver a complete Ultra-Wideband (UWB) solution combining baseband, software, and radio frequency (RF) technologies. The platform integrates Ceva-Waves™ UWB baseband IP and software with LG SoC Center’s UWB RF design on TSMC's 22nm process, securing early commercial validation through adoption by a major U.S. semiconductor company.

Context of the Cooperation
Ultra-Wideband technology is expanding rapidly beyond basic proximity-based digital keys and item trackers into high-value automotive, industrial, and enterprise applications that demand precise, secure spatial awareness and radar sensing. According to market projections by ABI Research, global UWB device shipments are anticipated to expand from 597 million units in 2026 to nearly 1.18 billion units by 2030. However, designing integrated UWB solutions requires complex RF engineering and baseband software coordination, which often increases engineering costs, silicon footprint, and integration risks for chip developers.

To reduce these barriers to entry and accelerate the time-to-market for custom silicon, cooperation was established between silicon and software IP specialist Ceva and consumer electronics and semiconductor developer LG Electronics. The partnership pairs Ceva's digital baseband and wireless IoT software assets with LG's in-house RF design capabilities, offering semiconductor vendors and original equipment manufacturers (OEMs) a pre-validated, silicon-ready foundation.

Technical Solution and Responsibilities
The technological framework combines digital baseband processing, software protocol stacks, and high-frequency RF front-end IP into a unified architecture. Responsibilities are divided between the partners to align digital baseband design with physical analog RF silicon:

Ceva supplies the Ceva-Waves UWB baseband IP and software stack, supporting the IEEE 802.15.4ab standard, extended ranging capabilities, radar sensing, and multi-channel configurations.

LG Electronics delivers the physical UWB RF technology developed by its SoC Center, optimized and validated for TSMC’s 22nm process node.

At a system level, the integrated solution delivers ranging performance across challenging non-line-of-sight (NLoS) operating environments and extended distances while maintaining low power consumption and high resilience to RF interference. In addition to micro-location capabilities, the platform incorporates UWB radar sensing to support spatial perception workloads across physical AI, industrial automation, and automotive cockpits.

KANG YongSeok, Vice President at LG Electronics, stated that combining LG’s UWB RF design capabilities with Ceva’s baseband and software technologies creates a complete solution that lowers adoption barriers for innovative wireless products. Tal Shalev, Vice President and General Manager of Ceva's Wireless IoT Business Unit, noted that unifying proven baseband, software, and RF assets provides customers with a highly integrated foundation for differentiated UWB designs, underscored by early customer validation from a major chipmaker.

Deployment or Implementation
The implementation strategy focuses on providing semiconductor manufacturers and OEMs with a pre-validated IP block ready for integration into next-generation system-on-chip (SoC) architectures.

The platform is engineered for deployment across automotive secure digital access, industrial asset tracking, indoor robotics navigation, precision positioning, and consumer electronics. Commercial implementation has commenced with an initial deployment agreement signed with a major U.S.-based semiconductor company, validating the silicon-ready platform ahead of broader industry adoption.

Edited by Romila DSilva, Induportals Editor, with AI assistance.