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TE advances next-generation high-density data centers at the 2025 OCP Global Summit
TE Connectivity will showcase a broad portfolio of interconnect solutions designed for higher speeds, scalability, and power efficiency in data center architectures.
www.te.com
TE Connectivity, a world leader in connectors and sensors, will showcase how it is contributing to the evolution of artificial intelligence (AI) and machine learning (ML) with products that are engineered for compatibility, interconnectivity and support industry standard form factors and performance requirements Oct. 14-16 at the 2025 OCP Global Summit in San Jose, California.
TE’s advancements in rack-level power and connectivity, including LVDC/HVDC distribution, liquid-cooled busbars and next-generation high-speed high-density solutions that support hyperscale, AI/ML and high-performance computing workloads, can be seen in booth #B34.
Demonstrations will highlight innovations across signal integrity and thermal management, such as active cabled backplanes with integrated retimers, 448G/lane co-packaged copper (CPC) connectors, liquid-cooled I/O and OCP NIC solutions, and 1.6T optical and copper interconnects. In collaboration with multiple industry partners, TE will demonstrate how these technologies come together to provide the building blocks for the next generation of data center systems.
TE Product Solutions on Display at OCP Global Summit
- Power Distribution: Innovative LVDC/HVDC rack power solutions, from facility busway to chip
- Rack-Level Integration: TE’s OCP rack-level technologies that help enable high-performance, high-density architectures
- High-Density Interconnects: Active cabled backplanes, 448G CPC connectors, and 224G OTB solutions that deliver high-bandwidth, low-loss connectivity with improved signal integrity for AI/ML and high-performance computing systems
- High-Speed Connectivity: Active copper and optical interconnects that deliver notable bandwidth and improved reliability
- Liquid Cooling Solutions: Advanced OCP NIC and I/O thermal solutions designed for restricted airflow and high-density power components.
